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Continental Structural Plastics’ Advanced Technologies Center Unveils Lightweighting, Battery Enclosure and Materials Innovations

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AUBURN HILLS, Mich.–(BUSINESS WIRE)–Continental Structural Plastics (CSP), along with its parent company Teijin, today unveiled an innovative honeycomb Class A panel technology and an advanced, multi-material EV battery enclosure that can be molded in any number of CSP’s proprietary composite formulations. These component technologies were developed at the company’s new Advanced Technologies Center located on Harmon Road in Auburn Hills, Michigan. This Advanced Technologies Center is CSP’s second R&D facility in the city.


The Advanced Technologies Center is a 47,500 square-foot facility of which 24,000 is dedicated to R&D efforts to develop next generation materials and processes to move CSP and Teijin beyond just SMC and into new markets and technologies. Equipment includes: