SUNNYVALE, Calif.–(BUSINESS WIRE)–Advanced Semiconductor Engineering, Inc. has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier (PQS) Award. The PQS Award recognizes companies like ASE that Intel believes have relentlessly pursued excellence and conducted business with resolute professionalism.
“I am pleased to recognize the winners of Intel’s Preferred Quality Supplier Award for 2019,” said Dr. Randhir Thakur, head of Global Supply Chain at Intel. “The commitment to continuous improvement and the rich collaboration with these suppliers remain crucial factors in enabling Intel to bring exciting products to market and meet the needs of our customers.”
SUNNYVALE, Calif.–(BUSINESS WIRE)–Advanced Semiconductor Engineering, Inc. has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier (PQS) Award. The PQS Award recognizes companies like ASE that Intel believes have relentlessly pursued excellence and conducted business with resolute professionalism.
“I am pleased to recognize the winners of Intel’s Preferred Quality Supplier Award for 2019,” said Dr. Randhir Thakur, head of Global Supply Chain at Intel. “The commitment to continuous improvement and the rich collaboration with these suppliers remain crucial factors in enabling Intel to bring exciting products to market and meet the needs of our customers.”
To qualify for PQS status, suppliers must exceed high expectations and uncompromising performance goals while scoring at least 80 percent on an integrated report card that assesses performance throughout the year. Suppliers must also achieve 80 percent or greater on a challenging continuous improvement plan and demonstrate solid quality and business systems.
Additional information is available at the Intel Newsroom.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, Automotive, High Performance Computing and more. To learn about our advances in SiP, Fanout, MEMS & Sensor, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @asegroup_global.
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